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PRODUCT

Product Introduction

Wafer Backside Cleaning System

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iClean300

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Comment 0Count View 335Time Date Created 21-08-25 17:52

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Wafer Backside Cleaning System  iClean300 


This system removes the contaminants on the back side of wafer to increase the yield rate in photo and CMP processes.

It is cost-effective with easy maintenance and low cost of ownership. 



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