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PRODUCT

Product Introduction

Package mold cleaning system

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100P-A

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Writer 관리자
Comment 0Count View 382Time Date Created 21-08-25 17:51

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Package mold cleaning system 100P-A


This system cleans the IC package molds.

This is an in-line mobile type to clean the molds without removing the molds from the press.

This system is efficient for cleaning of the compression molds. 



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