Laser
- Semiconductor test socket & probe card cleaning
- Semiconductor package Mold Cleaning to remove EMC residue
- Semiconductor Process equipment parts cleaning
- Oxide film and Surface dirt removal before welding (Secondary battery)
- Oxide film and Surface dirt removal before and after automobile parts welding
- Rust, primer, and paint removal in the Heavy Industry (Shipbuilding, Aerospace)
CO₂ MicroJet
- Wafer Cleaning System for HBM
- Surface cleaning before HBM PKG/PCB/OLED Display AOI test
- Particle removal in Assembly of the smart phone camera
- Burr removal in precision parts and injection molded parts
- Surface cleaning before coating/painting process of high-end parts
- Residue removal after Laser Processing (cutting/marking/repair)
Our 'EUV Mask Solution' stands as a core pillar demonstrating our advanced technological prowess. Following two successful joint development projects with a world-leading semiconductor enterprise, we achieved the commercialization of our 'EUV Mask Laser Baking' system. This breakthrough, along with our next-generation EUV Mask equipment currently under development, will serve as a powerful growth engine driving our expansion in the global market. Furthermore, building upon over 25 years of accumulated technological expertise, we have successfully expanded into the 'Chemical Metrology' sector, continuing to strengthen strategic collaborations with global chipmakers.